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MEDICAL FAIR INDIA’s 28th Edition Scales New Heights with a Record Turnout of 17,943 Visitors from the Global Healthcare Industry

Ranjith Fernando
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MEDICAL FAIR INDIA’s 28th Edition Scales New Heights with a Record Turnout of 17,943 Visitors from the Global Healthcare Industry

Giving a major fillip to the ‘Make in India’ vision of the government, MEDICAL FAIR INDIA 2023 achieves a new milestone by hosting the biggest ever Indian contingent of medical and healthcare manufacturers, alongside an impressive participation of the international players from the sector. The recently concluded 28th edition of the show that took place at Pragati Maidan, New Delhi from 27-29 April 2023, hosted 17,943 visitors to witness the innovations in medical products and services displayed by 450 exhibitors from 17 countries, including India.

Visitors from various industry segments came together for 3 days of conference & focused trade exhibition. The ‘Make in India’ Pavilion, supported by the Association of Indian Manufacturers of Medical Devices (AIMED) showcased indigenous innovations aligned towards the common human goal of ‘best and accessible health for all’.

The show was inaugurated in the presence of esteemed dignitaries from the industry. The guests of honour included Ms. Jennifer Daubeny, Minister (Commercial), High Commission of Canada, New Delhi, Mr. Baushuan Ger, Government Representative at Taipei Economic and Cultural Center in India and Mr. KR Chawla, Head of Office, Controlling & Licensing Authority, Drugs Control Dept. Govt. of NCT of Delhi.

MEDICAL FAIR INDIA 2023 hosted an elaborate trade platform wherein leading manufacturers of medical equipment, consumables, hospital furniture, surgical instruments, components, laboratory and infrastructure showcased more than 5000 products to the visitors. The well-segmented exhibition was spread across an area of 15000+ square meters. Exhibiting countries included Australia, Canada, China, Germany, Hungary, India, Israel, Italy, Malaysia, Singapore, Korea, Sri Lanka, Taiwan, Thailand, United Kingdom, United States of America, and Vietnam. Visitors also got the opportunity to interact and witness innovations at the 4 dedicated country pavilions setup by China, Canada, Korea and Hungary.

Mr. Rajiv Nath, Managing Director at Hindustan Syringes & Medical Devices Ltd, Forum Coordinator at AiMeD (Association of Indian Medical Devices Industry) and Chairman of the Advisory Committee of Medical Fair India 2023 stated, “I laud the efforts of the Messe Düsseldorf India team for making a sustained incremental movement in creating space for meaningful engagement of the national and international medical and healthcare manufacturing industry through this flagship Expo. This journey over the years has been of sheer quality and dedication. This year’s Medical Fair India has surpassed the previous milestones of scale by hosting the biggest ever space for AiMeD and Indian manufacturers. Showcasing young start-ups as well as innovative breakthroughs of the existing large-scale manufacturers of the country gave a major fillip to fulfilment of the ‘Make in India’ mission envisioned by Prime Minister, Shri Narendra Modi. The ‘Make in India’ Pavilion alongside the huge participation from 17 other countries brought together best of the minds, technologies and new arenas for collaborations, which is set to make a huge contribution in projecting India’s prowess in the global medical care landscape more so in light of the country’s successful launch of Made in India vaccine during COVID pandemic backed by Made in India AD Syringes for Safe Vaccine Delivery.”

Integrated Learning & Networking Platform

As special highlights for the visitors, MEDICAL FAIR INDIA also hosted dedicated pavilions with special focus on niche segments. One such feature was the ‘Rehaindia’ Pavilion, powered by ‘REHACARE’, a three-day parallel segment dedicated to the Indian rehabilitation sector. This sector is considered to have a particularly promising future due to the continuously increasing life expectancy and ageing of the Indian society.

On the other hand, Future for Health (FTR4H) Digital Health Start-up Pavilion & conference at the event, was a landmark platform for showcasing the possibilities created by AI-supported technology for the healthcare sector and also for encouraging international and local start-ups. The digitalisation of the Indian healthcare sector holds lucrative business opportunities for companies (including start-ups) from all over the world. The FTR4H Digital Health Start-up Pavilion was a key point of attraction on all 3 days of the show. The participating start-ups presented their solutions for the healthcare sector.

Appreciating the excellent response from the industry, Mr. Thomas Schlitt, Managing Director – Messe Düsseldorf India stated, “I am very delighted to see the healthcare community converging to make Medical Fair India the most significant platform for industry stakeholders. The show has witnessed tremendous growth in every edition. However, the 28th edition of Medical Fair India has surpassed all our expectations with a record-breaking number of visitors attending the show and the biggest ever representation of Indian companies on the exhibition floor. The participation of Indian start-ups and innovators at the ‘Make in India’ Pavilion also grew this year reflecting the contribution of Indian innovations towards the growth of the global healthcare industry. Growing at an exponential pace and with the support of key industry stakeholders, Medical Fair India will continue to deliver a world-class platform to engage and empower the industry year after year”.

Alongside the exhibits, MEDICAL FAIR INDIA also saw in-depth deliberations and discussions among the luminaries of the health and medical fair field, through 4 thought-provoking conferences.

On the first day of the show, the Voice of Healthcare 7th International Healthcare Conference put together a future-first platform to discuss emerging tech trends, smarter infrastructures for building smart hospitals from CXO’s perspective, revolutionising healthcare delivery with med-tech innovations among other topics. The conference was chaired by Dr. Naveen Nishchal, Founder – Meddo, Cygnus Hospital, VOH Incubator. The inaugural panel had representation from government as well as industry leaders. The panel focused on how the government is keeping up with the changing technology the world over and is supporting the Indian industry by making dynamic policies to bring forth home-born solutions onto the global stage. Another session hosted nursing leaders dwelling on the strategies and measures required to lift the nursing profession to the next level of excellence for better patient experience. Mr. Piyush Bhan, Senior Vice President, International Business Development, Salucro Healthcare Solutions India also presented insights on collaborative efforts for streamlining payment experience in Healthcare.

Hosted on the second day and chaired by Mr. Jatin Mahajan, Managing Director at J Mitra & Co., the Clin Lab India conference 2023 stood out for ensuring meaningful engagement of a large number of government policy makers, and members from the academia and industry. The guest of honour, Mr. N Yuvaraj, Joint Secretary of Department of Pharmaceuticals, Government of India encouraged the participants by sharing about the government’s specific policy-level measures to promote the growth of pharmaceuticals, medical devices including the IVD industry in India. Representatives from different government bodies, such as CDSCO, Invest India and NABCB emphasised on issues around the tender system, GeM portal, raising investment for the IVD industry and the need for harmonization of standards for medical devices & IVD and the role of AI. Representatives from ICMR, IIT Delhi, tech transfer organisations and start-ups shared about the progressive initiatives being taken at various levels, specifically at IITs, for fostering relationship with industry. The conference culminated with the session where start-ups shared promising and futuristic ideas for conquering the global IVD market.

The Smart Hospital conference, held on the final day of the show, brought together seasoned as well as young & bright medical experts from the government and private sector. The conference was chaired by Dr. B.K. Rana, CEO, Quality and Accreditation Institute (QAI). The conference kicked off with deliberation by experts from the government, including Dr. Pankaj Kumar Arora, Director, National Health Authority, as well as the industry leaders from Arogyam Medisoft, Dozee and Consint.ai. The integrated digital health infrastructure – Ayushman Bharat Digital Mission (ABDM) and the solutions it provides for integrating health records of citizens, healthcare professionals and policy makers, remained the highlight of the session. Alongside, other issues that attracted attention of the participants included telehealth platform targeting rural India enabling delivery of healthcare at the doorstep, smart telehealth solutions for patient monitoring, AI integration across patient journey, QAI accreditation by Practo to set the gold standards of delivery in telehealth, patient engagement for hospitals and accreditation program on telehealth for Quality and Safe Patient Care developed by QAI.

The ‘Future for Health’ (FTR4H) Digital Health Start-up Pavilion & conference, that has been a significant part of Medical Fair India for 6 consecutive years now, organised sessions under the theme “Data, AI and Personalization at Scale”. Moderated by Mark Wächter, Chief Evangelist for the Global FTR4H society, the sessions on all 3 days focused on various aspects of digital transformation of the healthcare sector. The programme was supported by industry players such as ‘NASSCOM – Center of Excellence – IoT & AI’ as the digital transformation partner, Nagarro as Gold Partner, NRW Global Business as German MedTech Partner along with IIT Kanpur as Academic Partner and other ecosystem partners were PATH, C-CAMP, GINSEP and Medikabazaar.

Concurrent to the exhibition and conferences, the ‘MT India Healthcare Awards’, organised by Medgate Today & powered by MEDICAL FAIR INDIA, honoured the best industry players, institutions and medical professionals for their exemplary work in the healthcare.

The show concluded on a high note with the promise of bringing an even more comprehensive platform in the years to come. The 29th edition of the show will be held in Mumbai from 13-15 March 2024.

A part of Messe Düsseldorf group’s medical exhibition portfolio `MEDICAlliance’, Medical Fair India is organised by Messe Düsseldorf India with the support of Make in India, Association of Healthcare Providers India (AHPI), Association of Indian Manufacturers of Medical Devices (AIMED), Association of Diagnostic Manufacturers of India (ADMI), Quality and Accreditation Institute (QAI) and Voice of Healthcare (VOH), GMAAF – Global Medtech Advocacy & Advisory Forum, NASSCOM Center of Excellence – IoT & AI and Healthcare Events as Knowledge partner for Clin Lab Conference.

All information on the MEDICA FAIR INDIA are available online at: https://www.medicalfair-india.com

 

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Fast and Effortless Wallpaper Offering by Xeikon and Ahlstrom Collaboration

Ranjith Fernando
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Fast and Effortless Wallpaper Offering by Xeikon and Ahlstrom Collaboration

Wallpaper has been around for a few centuries. But during the past twenty years, it has undergone an exciting reinvention. Driven by the global hype of “everything can and will be customized”, so-called single-wall solutions have become an interior design must have. Putting up, and removing, wallpaper can be quite an effort prompting consumers to seek professional help. This, of course, increases the cost of the final product: a decorated wall.

Ahlstrom has overcome a lot of the challenges of applying and removing wallpaper with its a new range of self-adhesive nonwovens. In fact, wallpaper can now be easily swapped, enabling consumers to confidently fully customise and redecorate walls themselves.

Ahlstrom’s WallStar Digital Peel & Up range makes decoration quick and effortless, even for a novice home decorator. No glue or special equipment is needed. It’s easy to reposition during installation and also straightforward to remove. The user can simply peel away the wallpaper of the release liner and apply it to the wall. Trouble-free removability enables smooth repositioning or replacement with a different design. No adhesive is left on the wall after removal. The Peel & Up range includes 100% PVC-free satin and matt media.

WallStar Digital Peel & Up is specifically designed to be printed using a Xeikon digital colour press. The Xeikon wall decoration solution, based on the Xeikon CX500 digital press, uses dry toner technology. The ability to print with five colours delivers design flexibility. Dry toner print technology stands for superior quality images and complies with all necessary regulations with regard to indoor emissions in the building industry.

Anna Brikh, Product Manager at Ahlstrom, comments,” As a substrate supplier we are literally in between the print and the consumer. The substrate has to bring those two worlds together, meeting market demands and ensuring the state-of-the-art quality of the end product. With our range of nonwovens for wall decor, we have always been looking to provide printers and consumers with high-quality and easy-to-use materials. We believe that WallStar Digital Peel & Up is an important step forward to meet the ongoing customisation trends in the decoration markets.”

“Digital print stands for printing whatever you need, whenever you need it”, says Dimitri Van Gaever, Xeikon’s director of segment marketing for the decoration markets, “We are delighted to be the partner of choice in this kind of development by leading industry players like Ahlstrom. We were very keen to test the Peel & Up range on our CX-series for wall deco as soon as possible. We believe it can become a game changer for the wall deco markets.”

Both Ahlstrom and Xeikon will be exhibiting at the upcoming Fespa Global Print Expo 2023, on stand B2 A20, 23-26 May in Munich, Germany.

For more information about Xeikon, visit www.xeikon.com

 

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Deep Black Laser Marking for Medical Technology: Foba Presents New Product at MedtecLIVE With T4M

Ranjith Fernando
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0

Deep Black Laser Marking for Medical Technology: Foba Presents New Product at MedtecLIVE With T4M

Product premiere at the trade fair: FOBA Laser Marking + Engraving is presenting a new product for deep black laser markings at the MedtecLIVE with T4M (Nuremberg, May 23-25, 2023). FOBA will also be part of the production line that premiered in Stuttgart last year and will be set up by several partner companies in the exhibition hall.

“We are excited to debut our latest product at MedtecLIVE with T4M. The product marks not only black, but deep black. This creates a particularly strong and long-lasting contrast with the laser marking,” reports Philipp Febel, Director of Product Management at FOBA. Visitors to the trade fair can see the marking quality for themselves live on site at the FOBA stand in Hall 1, Stand 1-612 and get advice from FOBA’s experts.

FOBA demonstrates laser marking as part of the value chain of a medical product on the production line. Here, the M2000-P laser marking workstation inscribes the trade fair sample in UDI-compliant quality and thus takes on the fifth of a total of seven work steps. Visitors can follow the entire process and, after three-stage component production, cleaning, labeling and passivation, receive a machine-packaged product to take away.

“The production line was already a magnet for visitors at the MedtecLIVE with T4M in Stuttgart last year and will therefore also be part of the trade fair in Nuremberg this year. The structure makes it possible to visualize the various production steps until the visitor holds the finished product in their hands,” says Christian Söhner, FOBA’s Global Vertical Manager Medical, who came up with the idea for the production line on the trade fair advisory board.

“Laser marking is one of the last steps in the production process. It must be ensured that there are no costly incorrect markings,” explains Christian Söhner. FOBA’s camera-based marking systems support the user with an optical inspection before and after the marking process and thus guarantee a safe and UDI-compliant process.

www.fobalaser.com

 

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Commercially Compostable VCI Film Brings Corrosion Protection ‘Back to Nature’!

Ranjith Fernando
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Commercially Compostable VCI Film Brings Corrosion Protection ‘Back to Nature’!

What if plastic packaging could go back to nature once it was used-not only for organics waste, but also for specialty rust preventative packaging? That is what Cortec seeks to do with Eco-Corr Film as a viable option for manufacturers who want to “go green” and reduce plastic pollution while preventing rust on metal.

Rust Prevention and the Circular Economy

Facilities can choose from a variety of ways to introduce the “circular economy” into their rust prevention plan. Among these are the options to select biobased rust preventatives or recyclable paper or plastic packaging products. Such products contribute to the circular economy by being sourced from renewable raw materials and/or by following a sustainable path to recycling at the end of the life cycle. Another increasingly common pathway to sustainability is the composting option, which diverts packaging from the landfill or incinerator and returns it to nature in an industrial composting facility. While most commercially compostable packaging is specifically made for food and yard waste disposal, new industrially compostable materials have been emerging for other packaging purposes including corrosion protection of metals ruring shipping.

When it comes to rust preventative packaging, Cortec’s VpCI-126 Film has become a familiar standard, often recognized by its trademarked VpCI-126 Blue color. While VpCI-126 is widely used in the automotive, preservation, and other industries with the excellent disposal option of recycling it into other valuable materials, it does not have the compostability option. However, Cortec’s longtime interest in exploring biodegradable technology has led to the most recent TÜV Austria certified industrially compostable version of Eco-Corr Film, a commercially compostable VCI (vapor corrosion inhibitor) packaging material that does not pose an ecotoxicity threat to plant growth.

Metal parts packaged in Eco-Corr Film receive ongoing protection against salt, excessive humidity, condensation, moisture, and aggressive industrial atmospheres. In addition to serving as a physical barrier to the elements and inhibiting corrosion on metals in direct contact with the film, Eco-Corr Film also contains Vapor phase Corrosion Inhibitors that vaporize and then condense on all accessible metal surfaces within the enclosed package to interrupt the corrosion reaction between metal, oxygen, and an electrolyte. Eco-Corr Film meets German TL-8135-002 and NACE TM0208-2018 standards for corrosion protection and can be used to protect a wide variety of metals, including carbon steel, aluminum, galvanized steel, stainless steel, copper, and brass during domestic and overseas shipments. After use, Eco-Corr Film can be disposed in an industrial composting environment, giving it a final non-polluting destination in the soil.

Who Needs Compostable VCI Film?

Compostable technology such as Eco-Corr Film will be of special interest to companies currently looking for ways to introduce environmental initiatives and fight plastic pollution. The auto industry, which has relied heavily on recyclable VpCI-126 plastic bags, is a prime candidate as they seek to inhibit corrosion on metal parts in ways that are considered more environmentally benign. Companies that sell consumer goods are also aware that many customers will be happy to see efforts to reduce environmental impact with packaging that meets EN 13432/ASTM D6400 standards for commercial compostability. Whatever the driving force, Eco-Corr Film is here to offer packaging material that meets those standards while providing corrosion protection to metal components.

www.cortecpackaging.com

 

 

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Greif Launching Updated Carbon Calculator at Interpack 2023

Ranjith Fernando
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0

Greif Launching Updated Carbon Calculator at Interpack 2023

Greif, a global leader in industrial packaging products and services, will launch a significant update to its proprietary interactive carbon emissions reduction calculator at interpack in Germany. The tool is designed to help customers achieve their sustainability goals by understanding the carbon footprint of their packaging.

A version of the company’s Green Tool, which evaluates the environmental impact of industrial packaging solutions produced by Greif using independent lifecycle data, Green Tool Lite will provide customers with carbon footprint metrics for its most popular IBCs, plastic and steel drum products, quickly and efficiently through an easy to use interface.

Green Tool Lite gives customers easy access to environmental impact data by allowing them to analyze and compare specific industrial packaging products by entering key information into a calculator. Results are provided through a simple chart that shows the CO2 emissions created through the manufacture and transportation of one or more product types, such as a new IBC versus a reconditioned one. Also provided is the CO2 emissions equivalence, for example the number of trees that would need to be planted to sequester the same amount of emissions.

“We are excited by the opportunity Green Tool Lite provides in supporting and enabling more customers in their sustainability journey, and we are delighted to be able to showcase it at interpack,” explains Aysu Katun, VP of Sustainability at Greif.

“It will allow us to assist more customers in making informed decisions about their industrial packaging to help reach their sustainability targets. It also supports our own commitment to advancing a circular economy and reducing greenhouse gas emissions. Each of us has a responsibility to protect the environment and reduce our environmental impact and the opportunity for positive change is greatest through collaboration.”

Touch screens with motion sensors will be available at Greif’s exhibition stand at interpack in Hall 10, B07.B17 for visitors interested in trying out the new sustainability software, which will be available to all customers at www.greif.com in the coming months.

Additional information is on the Company’s website at www.greif.com

 

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Optimized Mold Tempering

Ranjith Fernando
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Optimized Mold Tempering

Simulation Provides Insight and Reliable Improvement

At the Moulding Expo, SIGMA Engineering presents the simulation-based design of tempering systems using SIGMASOFT. In collaboration with /H&B/ ELECTRONIC, conventional cooling is compared with conformal cooling. Additionally, optimized cooling channels made from metal 3D printing are presented, which can offer enormous advantages.

At the Moulding Expo 2023 in Stuttgart (June 13-16, 2023), SIGMA Engineering GmbH presents at booth 1E18 insights into mold simulation and the simulative design of tempering systems using SIGMASOFT. Simulation is critical to project success in plastics processing, including tooling, where geometries, gating position, and process design can already be optimized. /H&B/ ELECTRONIC relies on SIGMASOFT for the design and dimensioning of temperature control channels.

Cooling is critical to the quality of thermoplastic components. Temperature differences lead to different cooling rates and create residual stresses and warpage in the finished component. This becomes problematic when there are differences in wall thickness within the component, as the cooling requirements are highly variable locally. Conformal cooling, meanwhile, is an established concept in tooling that is increasingly being used. Simulation allows the cost of conformal cooling to be evaluated in advance against the advantages of the conventional concept (improved component quality, shorter cycle times, etc.).

3D printing has revolutionized the possibilities for component production. It is now possible to produce completely arbitrary channels (regardless of feasibility using milling, drilling, assembly, and sealing). /H&B/ ELECTRONIC and SIGMASOFT have carefully examined the simulation-based design of a novel temperature control system made using 3D printing. The results will be shown at both exhibitors’ stands at the trade fair.

“Analysis and fluidic design of cooling channels are just one of dozens of successful applications of SIGMASOFT,” explains Timo Gebauer, CTO of SIGMA. “What they all have in common is the ability to understand what is happening before money and time are invested. This was an exciting project where we were able to accompany this successful innovation.” Jan Bayerbach, Head of Development & Construction at /H&B/ ELECTRONIC, adds: “We have been relying on SIGMASOFT for many years to develop and optimize our products before they are even manufactured. The good correlation between simulation and reality has always impressed us. We are particularly proud of the mold inserts we developed using 3D printing.”

Temperature distribution just before demolding, with conformal cooling from 3D printing on the left (only visible halfway trough), and conventional cooling on the right.

www.sigmasoft.de

 

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New Han Solution for Easier Field Termination

Ranjith Fernando
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New Han Solution for Easier Field Termination

HARTING’s Connectivity+ solutions are an important element in energy transformation. Alongside the need to work sustainability, HARTING is responding to additional challenges from its customers. The shortage of specialists and skills can be countered by making the installation of electrical equipment as simple and safe as possible. HARTING is expanding the greatest variety of connection technologies on the market to include its new Han Push-In technology, which requires no tools at all. As a result, assembly times in the field are reduced by up to 30%.

Fast on-site termination

Depending on requirements, an intelligent combination of different connection technologies delivers the best results. Han Push-In now further extends this portfolio.

The new technology simplifies the handling of components during maintenance work in environments with limited room for manoeuvre, such as in wind turbines. It is particularly well suited to applications where a high degree of flexibility is required, such as when changing tools on machines. Thanks to Han Push-In, this can be done simply, quickly and without the need for tools.

The connection technology behind the Han Push-In protected modules DD/E/EE/C/CC represents a refinement cage clamp springs which are particularly well suited to field termination due to their speed and ease of use. With push-in technology, the stranded wire for the connection can be inserted directly into the contact chambers. An internal clamp spring ensures a high-strength contact. If ferrules are used, the connection can be established without tools. In the case of stripped stranded wires, all you need for installation is a screwdriver.

Advantages of Han Push-In:

  • Up to 30% less assembly time with direct insertion of the conductor into the contact chamber
  • Easy handling due to tool-less termination
  • Cost savings compared to alternative termination technologies
  • Maximum flexibility: termination can be made for ferrules, stranded wires and solid conductors
  • Plug compatibility with identical products with other termination technologies
  • Safe installation thanks to electric shock-protected contacts
  • Increased flexibility during installation because of different termination technologies: PCB and Crimp

www.harting.com

 

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Molecor Reaffirms Its Commitment to the Circular Economy by Celebrating “World Recycling Day”

Ranjith Fernando
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0

Molecor Reaffirms Its Commitment to the Circular Economy by Celebrating “World Recycling Day”

World Recycling Day is celebrated on May 17, its objective is to raise awareness in society of the importance of carrying out a correct recycling of the waste generated in our daily activity.

Currently there is a worldwide concern about the depletion of resources that human activity is generating on the planet. For Europe, it is a priority to achieve a completely sustainable economy in the year 2030, and through its Circular Economy Strategy it is making significant progress in its objective. In fulfilling this objective, in addition to citizens, companies must also participate, uniting this change in management model to contribute to the correct sustainable development of the planet and ensure the future of the next generations.

In the process of transition to a Circular Economy model, recycling is of vital importance, since in addition to being necessary to make sustainable use of resources, minimize the waste generated and encourage reuse, it is absolutely essential to advance in recycling, to thus convert the waste generated into a new source of resources.

Molecor is fully committed to preserving the Environment, with the Circular Economy being one of the fundamental pillars of the company’s activity. First of all, all its products are eco-designed from their conception, making sustainable use of resources and minimizing material consumption, as well as showing high durability and total recyclability.

PVC is the majority of the waste generated in the productive activity, it is reused as a new resource in the manufacture of new pipes and fittings, thus avoiding the consumption of new raw materials, and minimizing the generation of real waste from the activity to practically zero waste.

To improve the circularity of Oriented PVC (PVC-O) pipes and fittings, Molecor has developed geoTOM, a geolocation application that has a double function: on the one hand, it initially allows the user to unequivocally establish a location map of each one of the pipes in the network, and on the other hand, it favors the recycling of the pipes at the end of their long life cycle, estimated at more than 100 years. This second function is possible since the application provides information on the situation and the type of buried pipe, so it is possible to proceed with its uninstallation and send it for recycling to thus convert it into a new source of resources.

All these actions carried out in favor of the Circular Economy have reduced the environmental impact of Molecor’s activity, a task in which it continues to work daily to continue showing its commitment to caring for the planet.

www.molecor.com

 

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WACKER Presents Silicone Resin for High-Temperature Resistant Molded Parts at CWIEME Berlin

Ranjith Fernando
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0

WACKER Presents Silicone Resin for High-Temperature Resistant Molded Parts at CWIEME Berlin

At this year’s CWIEME tradeshow for coil winding, insulation and electrical manufacturing, WACKER is presenting a novel material solution to manufacture mechani-cally durable plastic components that can withstand tempera-tures of over 200 degrees Celsius for long periods. Thanks to the silicone resin binders SILRES LR 700 and POWERSIL Resin 700 and the binder-based silicone molding material POWERSIL Resin 710, manufacturers can create molded parts via compression molding, pressure gelation or even injection molding technologies. This makes the product suitable for molded parts, which comply to insulation class R and have to withstand temperatures of up to 220°C for extended periods of time. CWIEME takes place from May 23 – 25 in Berlin, Germany.

The new silicone resin binders, which are not subject to labeling requirements under EU directives, offer several advantages and are therefore an alternative to high-temperature-resistant polymers like PTFE (polytetrafluoroethylene) and PEEK (polyether ether ketone). Components produced using these new products are hallmarked by good mechanical strength and UV stability. The silicone materials involved can be processed with roughly the same ease as com-pounds like epoxide-based or polyurethane-based resins, which are very commonly used for producing components subject to lower levels of thermal stress.

SILRES LR 700 and POWERSIL Resin 700, both solvent-free phenyl methyl silicone resin binders, are transparent, low-viscosity liquids. Both binders require suitable combinations of fillers when processed into molded parts with good mechanical properties. WACKER has therefore developed an optimized formulation called POWERSIL Resin 710. This means that the company has two alternatives on the market for manufacturing molded parts that are stable at high temperatures: customers who prefer to work with their own fillers and/or filler blends, can use SILRES LR 700 and POWERSIL Resin 700 liquid binders; the best pick for users who want to take advantage of ready-to-use solutions, is POWERSIL Resin 710. The formulation comprises the silicone resin binder and a filler blend consisting of powdered and fibrous fillers.

WACKER’s innovations are a response to increasing industry demand for polymers that resist high temperatures. Because techni-cal systems are becoming increasingly more powerful and, at the same time, smaller, they emit more heat per unit area. In electric vehicle motors, for example, losses of five Watts per cubic centi-meter are not unusual. Electrically insulating polymer-based compo-nents positioned near these kinds of heat sources need to work flaw-lessly for years and retain their properties in the face of the high temperatures generated.

Further product highlights at CWIEME 2022:

SILRES H60

The silicone resin SILRES H60 was specifically developed for the trickle impregnation of electric motors. It cures rapidly into a heat-resistant and electrically insulating thermoset, thereby making itpossible to quickly impregnate the coil winding. What is more, elec-tric motors impregnated with this resin exhibit considerable thermal stability and durability. The new silicone resin is ideal for impregnat-ing the motors of smoke extraction fans and electric cars.

ELASTOSIL N 9111

The tin-free formulated one-component silicone rubber is a versatile adhesive and sealant for applications in the automotive, electrical, and electronics industries. It cures at room temperature in the pres-ence of atmospheric moisture and is characterized by excellent heat resistance and good mechanical properties. The silicone adheres to many substrates such as aluminum, stainless steel, glass, polyamide or polyvinyl butyral and offers continuous thermal stability up to 200 degrees Celsius when cured. ELASTOSIL N 9111 complies with the UL94 V-0 fire safety standard of the US testing institute Underwriters Laboratories and meets the requirement sets R22, R23 and R24 respectively for the Hazard Levels HL1-3 according to the railway vehicle fire protection standard EN 45545-2. The product is available in black.

www.wacker.com

 

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KIL Reports a Fourth Quarter of FY 2023, With Consolidated Year-to-Date Net Profit at INR 460 Crore

Ranjith Fernando
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KIL Reports a Fourth Quarter of FY 2023, With Consolidated Year-to-Date Net Profit at INR 460 Crore

Kirloskar Industries Ltd (KIL) (BSE: 500243; NSE: KIRLOSIND), announced today its audited financial results for the fourth quarter and the full year ended March 31, 2023.

Commenting on the Q4 and the full-year results, Mr.Mahesh Chhabria, Managing Director, KIL, said, ”The past year has primarily been dedicated to reorienting the Company. The Management has decided to focus on its real estate business and that of its wholly owned subsidiary “Avante Spaces Limited” (Avante) and optimize returns on its investment portfolio. In view of the same, the Management is desirous of monetizing its assets. During the year we sold our 17.41% stake in Swaraj Engines Limited for an aggregate consideration of approximately INR 296 crore. Further, the board has approved the sale of the windmill business to ISMT Limited, our step-down subsidiary. This is subject to all the necessary approvals. The first commercial project of Avante is progressing as planned and it has already sold approx 1.2 lakh sq ft area in the project.”

Review of Q4 & FY 2022-23 Financial Performance (Consolidated):

  • Total Income at INR 1,592.1 Cr for Q4 FY23 vs INR 1,053.7 Cr for Q4 FY22; 51% increase Y-o-Y
  • PBT at INR 164.6 Cr for Q4 FY23 vs INR 79.1 Cr for Q4 FY22; 108% increase Y-o-Y
  • PAT* at INR 93.1 Cr for Q4 FY23 vs loss of INR 4.4 Cr for Q4 FY22
  • Total Income at INR 6,536.0 Cr for FY23 vs INR 3,820.8 Cr for FY22; 71% increase Y-o-Y, please note that FY 23 includes the performance of our step-down subsidiary ISMT Ltd
  • PBT at INR 657.8 Cr for FY23 vs INR 568.3 Cr for FY22; 16% increase Y-o-Y
  • PAT* at INR 459.5 Cr for FY23 vs INR 316.2 Cr for FY22; 45% increase Y-o-Y

Review of Q4 & FY 2022-23 Financial Performance (Standalone):

  • Total Income at INR 40.4 Cr for Q4 FY23 vs INR 29.1 Cr for Q4 FY22; 39% increase Y-o-Y
  • PBT at INR 32.2 Cr for Q4 FY23 vs INR 22.5 Cr for Q4 FY22; 43% increase Y-o-Y
  • PAT* at INR 25.0 Cr for Q4 FY23 vs INR 16.0 Cr for Q4 FY22; 57% decrease Y-o-Y
  • Total Income at INR 118.3 Cr for FY23 vs INR 102.7 Cr for FY22; 15% increase Y-o-Y
  • PBT at INR 93.4 Cr for FY23 vs INR 80.1 Cr for FY22; 17% increase Y-o-Y
  • PAT* at INR 74.1 Cr for FY23 vs INR 60.9 Cr for FY22; 22% increase Y-o-Y

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