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April, 26

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UniPack by Platinum Industries: Revolutionizing CPVC Compounding Technology At the recently concluded Vinyl India Summit 2025—one of the world’s largest vinyl-focused gatherings—Platinum Industries Ltd. unveiled its latest innovation: UniPack, a next-generation, all-in-one additive pack engineered specifically for CPVC pipe and fitting manufacturers. With this launch, Platinum reinforces its position as...
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MediaTek’s highly integrated 7nm T750 chipset delivers 5G broadband experiences in a compact, low-power form factor

MediaTek’s highly integrated 7nm T750 chipset delivers 5G broadband experiences in a compact, low-power form factor MediaTek and NEC Platforms, Ltd. today announced the first NEC 5G customer-premise...

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